ALPHA OM-5100 Solder Paste is a low residue, no-clean solder paste designed to maximize first pass yields. The ALPHA OM-5100 activation system is optimized to enhance joint solderability and limit post reflow soldering defects.
| Alloy | 63/37 |
| Powder Size | Type 4 |
| Container | 700g Cartridge |
| Flux Type | Water-Soluble |
This paste's wide reflow profile window enables soldering with lead free components. ALPHA OM-5100 is designed for complex assemblies with small (0201) tin finished passives and enables solderability with large (1mm pitch) BGA components containing lead free spheres.
Features
- Consistent fine-feature print volume repeatability
- Low post reflow residue
- Reduction in Mid chip solder ball defects
- Minimizes random solder balling
Samples available upon request.