Alpha CVP-390 is a lead-free, zero-halogen no-clean solder paste designed for applications where residue with excellent pin testing property and abbility to pass JIS Copper Corrosion tests are required.
| Alloy | SAC305 |
| Powder Size | Type 4 |
| Container | 600g Cartridge |
| Flux Type | Water-Soluble |
This product is also designed to enable consistent fine pitch printing capability, down to 180 µm circle printed with 100 µm thickness stencil. Its excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability. Additionally, CVP-390 achieves IPC-7095 Class 3 voiding performance.
Samples available upon request.