ALPHA OM-5300 is a zero halogen, no clean solder paste developed to meet the demands of tin lead soldering when lead-free components are present in the circuit assembly. It provides excellent print volume repeatability and minimizes print cycle time by enabling high print speeds and an extended number of prints between stencil undercleaning.
The paste is capable of withstanding long, hot soak reflow profiles, allowing better wetting of lead-free surfaces with tin lead paste alloy. Excellent BGA voiding and high post reflow SIR performance make it ideal for tin lead soldering when lead-free components are used.
Alloy: 63/37
Powder Size: Type 4
Container: 500g Jar
Alpha Item: 162714