A tin-lead, water soluble solder paste designed for a broad range of SMT processes where aqueous post reflow cleaning is required.
- High throughput & yield with consistent print volumes at print speeds ranging 1–6 in/s
- Exhibits resistance to slumping and drying at temperature up to 19-29 °C (66 – 84°F) and 35-65% relative humidity
- Excellent cleanability after 2 reflows
| Alloy | 63/37 |
| Powder Size | Type 3 |
| Container | 700g Cartridge |
| Flux Type | Water-Soluble |
Product Overview
ALPHA WS-809 is a SnPb water soluble solder paste formulated to offer excellent cleanability after multiple reflows. This paste exhibits superior resistance to slump and drying under harsh processing conditions.
ALPHA WS-809 is formulated to offer flexibility across printing speeds ranging from 1”/sec (25 mm/s) to 6”/sec (150 mm/s) with stencil thicknesses of 5 mil (0.125 mm) to 6 mil (0.15 mm).
Samples available upon request.