A no-clean RMA solder paste with excellent soldering performance
RMA-SMQ®51AC is an air reflow, RMA solder paste designed for use in a wide range of environmental conditions. It has exceptional stencil life and tack strength, and offers consistent print definition even in ultrafine-pitch applications. RMA SMQ®51AC’s wide processing window allows it to be used with standard eutectic SnPb, SnPbAg, and high-temperature alloys, including AuSn, SnSb, and SnAg.
Features
• Wide reflow process window
• Consistent fine-pitch print deposition
• Superior tack strength
• Exceptional wetting in air reflow
RMA-SMQ51AC Technical Bulletin
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Samples available upon request